Q&A with Ann Kelleher, SVP & GM of Technology Development at Intel on the company's new logic roadmap, lithography, packaging, and process technology (Semiconductor Engineering) - TechnW3

Q&A with Ann Kelleher, SVP & GM of Technology Development at Intel on the company's new logic roadmap, lithography, packaging, and process technology (Semiconductor Engineering) - TechnW3

Semiconductor Engineering:
Q&A with Ann Kelleher, SVP & GM of Technology Development at Intel on the company's new logic roadmap, lithography, packaging, and process technology  —  Five process nodes in four years, high-NA EUV, 3D-ICs, chiplets, hybrid bonding, and more.  —  Ann Kelleher, senior vice president …

from TechnW3